1 motorola smallsignal transistors, fets and diodes device data
schottky barrier diodes these devices are designed primarily for highefficiency uhf and vhf detector applications. they are readily adaptable to many other fast switching rf and digital applications. they are supplied in an inexpensive plastic package for lowcost, highvolume consumer and industrial/commercial requirements. they are also available in a surface mount package. ? extremely low minority carrier lifetime 15 ps (typ) ? very low capacitance 1.5 pf (max) @ v r = 15 v ? low reverse leakage i r = 13 nadc (typ) mbd301, mmbd301 maximum ratings (t j = 125 c unless otherwise noted) mbd301 MMBD301LT1 rating symbol value unit reverse voltage v r 30 volts forward power dissipation @ t a = 25 c derate above 25 c p f 280 2.8 200 2.0 mw mw/ c operating junction temperature range t j 55 to +125 c storage temperature range t stg 55 to +150 c device marking MMBD301LT1 = 4t electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit reverse breakdown voltage (i r = 10 m a) v (br)r 30 e e volts total capacitance (v r = 15 v, f = 1.0 mhz) figure 1 c t e 0.9 1.5 pf reverse leakage (v r = 25 v) figure 3 i r e 13 200 nadc forward voltage (i f = 1.0 madc) figure 4 v f e 0.38 0.45 vdc forward voltage (i f = 10 madc) figure 4 v f e 0.52 0.6 vdc note: MMBD301LT1 is also available in bulk packaging. use mmbd301l as the device title to order this device in bulk. thermal clad is a registered trademark of the berquist company. preferred devices are motorola recommended choices for future use and best overall value. order this document by mbd301/d
semiconductor technical data motorola preferred devices case 182 02, style 1 (to226ac) case 318 08, style 8 sot 23 (to 236ab) 1 2 3 1 2 3 cathode 1 anode 30 volts silicon hotcarrier detector and switching diodes 2 cathode 1 anode ? motorola, inc. 1997
2 motorola smallsignal transistors, fets and diodes device data typical electrical characteristics figure 1. total capacitance v r , reverse voltage (volts) figure 2. minority carrier lifetime i f , forward current (ma) figure 3. reverse leakage v r , reverse voltage (volts) figure 4. forward voltage v f , forward voltage (volts) , forward current (ma) i f , reverse leakage ( a) i r 0.2 0.4 0.6 0.8 1.0 1.2 100 10 0 6.0 12 18 24 10 1.0 0.1 0.01 0.001 01020 500 0 0 3.0 6.0 9.0 12 15 21 1.6 30 24 27 18 1.2 0.8 0.4 f = 1.0 mhz t a = 40 c t a = 85 c t a = 25 c 1.0 0.1 30 40 50 60 70 80 100 90 krakauer method 0 2.8 2.4 2.0 30 t a = 100 c 75 c 25 c , total capacitance (pf) c t , minority carrier lifetime (ps) 400 300 200 100 sinusoidal generator ballast network (pads) sampling oscilloscope (50 input) pads capacitive conduction forward conduction storage conduction dut i f(peak) i r(peak) figure 5. krakauer method of measuring lifetime
3 motorola smallsignal transistors, fets and diodes device data information for using the sot23 surface mount package minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self align when subjected to a solder reflow process. sot23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 sot23 power dissipation the power dissipation of the sot23 is a function of the drain pad size. this can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. power dissipation for a surface mount device is determined by t j(max) , the maximum rated junction temperature of the die, r q ja , the thermal resistance from the device junction to ambient, and the operating temperature, t a . using the values provided on the data sheet for the sot23 package, p d can be calculated as follows: p d = t j(max) t a r q ja the values for the equation are found in the maximum ratings table on the data sheet. substituting these values into the equation for an ambient temperature t a of 25 c, one can calculate the power dissipation of the device which in this case is 225 milliwatts. p d = 150 c 25 c 556 c/w = 225 milliwatts the 556 c/w for the sot23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. there are other alternatives to achieving higher power dissipation from the sot23 package. another alternative would be to use a ceramic substrate or an aluminum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher than the rated temperature of the device. when the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. ? always preheat the device. ? the delta temperature between the preheat and soldering should be 100 c or less.* ? when preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. when using infrared heating with the reflow soldering method, the difference shall be a maximum of 10 c. ? the soldering temperature and time shall not exceed 260 c for more than 10 seconds. ? when shifting from preheating to soldering, the maximum temperature gradient shall be 5 c or less. ? after soldering has been completed, the device should be allowed to cool naturally for at least three minutes. gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. ? mechanical stress or shock should not be applied during cooling. * soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.
4 motorola smallsignal transistors, fets and diodes device data package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. contour of package beyond zone r is uncontrolled. 4. dimension f applies between p and l. dimensions d and j apply between l and k minimum. lead dimension is uncontrolled in p and beyond dim k minimum. style 1: pin 1. anode 2. cathode case 18202 issue h (to226ac) a l k b r f p d h g xx seating plane 12 v n c n section xx d j dim min max min max millimeters inches a 0.175 0.205 4.45 5.21 b 0.170 0.210 4.32 5.33 c 0.125 0.165 3.18 4.49 d 0.016 0.022 0.41 0.56 f 0.016 0.019 0.407 0.482 g 0.050 bsc 1.27 bsc h 0.100 bsc 3.54 bsc j 0.014 0.016 0.36 0.41 k 0.500 12.70 l 0.250 6.35 n 0.080 0.105 2.03 2.66 p 0.050 1.27 r 0.115 2.93 v 0.135 3.43 case 31808 issue af sot23 (to236ab) style 8: pin 1. anode 2. no connection 3. cathode d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maxiumum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters which may be provided in motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or death may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that motorola was negligent regarding the design or manufacture of the part. motorola and are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. mfax is a trademark of motorola, inc. how to reach us: usa / europe / locations not listed : motorola literature distribution; japan : nippon motorola ltd.; tatsumispdjldc, 6f seibubutsuryucenter, p.o. box 5405, denver, colorado 80217. 3036752140 or 18004412447 3142 tatsumi kotoku, tokyo 135, japan. 81335218315 mfax ? : rmfax0@email.sps.mot.com touchtone 6 022446609 asia / pacific : motorola semiconductors h.k. ltd.; 8b tai ping industrial park, us & canada only 18007741848 51 ting kok road, tai po, n.t., hong kong. 85226629298 internet : http://motorola.com/sps mbd301/d ?
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